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SK系列聚酰亚胺注塑料

PRODUCT

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0519-8313 8267

0519-8313 1261

SK series Polyimide molding powder

SK series Polyimide ultrafine powder

SK series Soluble polyimide ultrafine powder

SK bismaleimide resin

SK series epoxy resin

SK series Polyamide acid solution

Number Name Grade Features and uses
1 Polyimide molding powder SK-010 Output PI, thermal deformation temperature greater than 400 DEG C, used in the manufacture of aircraft engine parts, bearings, bearing, gasket, wear strip and other products.
2 Polyimide molding powder SK-0110 High and low temperature resistance, radiation resistance, self lubrication, creep resistance. Can be used for cigarette machine cigarette packets and other products.
3 Polyimide molding powder SK-0120 It has the characteristics of high temperature resistance, high strength, wear resistance, self lubrication and radiation resistance, and the thermal deformation temperature is 239 DEG C. It is used for high precision products such as guide ring, high temperature resistant insulation parts, gasket gasket and so on.
4 Polyimide molding powder SK-0130 Long term use temperature 230 C. Can be used for sealing rings, piston rings and other products.
5 Polyimide ultrafine powder SK-0131 The glass transition temperature is greater than 260 ℃, which can be dissolved in polar solvent (NMP). The product can be used for interlayer toughening of high temperature epoxy and bismaleimide based carbon fiber composites.
6 Polyimide ultrafine powder SK-0132 The glass transition temperature is greater than 260 ℃, which can be dissolved in polar solvent (NMP). The product can be used for interlayer toughening of high temperature epoxy and bismaleimide based carbon fiber composites.
8 Soluble polyimide ultrafine powder SK-0170 The glass transition temperature is greater than 290 ℃, which can be dissolved in polar solvents (DMF, DMAC, NMP, etc.). The product can be used for interlayer toughening of high temperature resistant epoxy and bismaleimide based carbon fiber composites.
9 Soluble polyimide ultrafine powder SK-0180 The glass transition temperature is greater than 310 ℃, which can be dissolved in a variety of solvents (DMF, DMAC, NMP, butyrolactone, etc.). The product can be used for interlayer toughening and gas separation membranes of high temperature resistant epoxy and bismaleimide based carbon fiber composites.
10 Soluble polyimide ultrafine powder SK-0190 The glass transition temperature is greater than 320 ℃, which can be dissolved in a variety of solvents (DMF, DMAC, NMP, butyrolactone, etc.). The product can be used for interlayer toughening and gas separation membrane of high temperature resistant epoxy and bismaleimide based carbon fiber composites.
11 bmi SK-0310 Low melting point, solubility, good solubility, good toughness, for the defense industry and other departments. Can be used as epoxy resin modifier.
12 epoxy resin SK-0430 High temperature resistant resin, amber transparent, lighter in color, can be used for pultrusion pipe, rod and composite products manufacturing.
13 polyamic acid solution SK-0910 PMDA PI resin, manufacturing film, fiber, coating, enameled wire products etc..
14 polyamic acid solution SK-0920 Ether anhydride type PI resin, water vapor resistance, used in the production of ductile film, coating, composite resin matrix.
15 polyamic acid solution SK-0930 PI resin, suitable for various coatings, high temperature adhesives, etc..
16 polyamic acid solution SK-0940 Bisphenol A two anhydride type PI resin, used in the production of films, coatings and other products, is a good toughening modifier.