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PRODUCT
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SK series Polyimide molding powder
SK series Polyimide ultrafine powder
SK series Soluble polyimide ultrafine powder
SK bismaleimide resin
SK series epoxy resin
SK series Polyamide acid solution
| Number | Name | Grade | Features and uses |
| 1 | Polyimide molding powder | SK-010 | Output PI, thermal deformation temperature greater than 400 DEG C, used in the manufacture of aircraft engine parts, bearings, bearing, gasket, wear strip and other products. |
| 2 | Polyimide molding powder | SK-0110 | High and low temperature resistance, radiation resistance, self lubrication, creep resistance. Can be used for cigarette machine cigarette packets and other products. |
| 3 | Polyimide molding powder | SK-0120 | It has the characteristics of high temperature resistance, high strength, wear resistance, self lubrication and radiation resistance, and the thermal deformation temperature is 239 DEG C. It is used for high precision products such as guide ring, high temperature resistant insulation parts, gasket gasket and so on. |
| 4 | Polyimide molding powder | SK-0130 | Long term use temperature 230 C. Can be used for sealing rings, piston rings and other products. |
| 5 | Polyimide ultrafine powder | SK-0131 | The glass transition temperature is greater than 260 ℃, which can be dissolved in polar solvent (NMP). The product can be used for interlayer toughening of high temperature epoxy and bismaleimide based carbon fiber composites. |
| 6 | Polyimide ultrafine powder | SK-0132 | The glass transition temperature is greater than 260 ℃, which can be dissolved in polar solvent (NMP). The product can be used for interlayer toughening of high temperature epoxy and bismaleimide based carbon fiber composites. |
| 8 | Soluble polyimide ultrafine powder | SK-0170 | The glass transition temperature is greater than 290 ℃, which can be dissolved in polar solvents (DMF, DMAC, NMP, etc.). The product can be used for interlayer toughening of high temperature resistant epoxy and bismaleimide based carbon fiber composites. |
| 9 | Soluble polyimide ultrafine powder | SK-0180 | The glass transition temperature is greater than 310 ℃, which can be dissolved in a variety of solvents (DMF, DMAC, NMP, butyrolactone, etc.). The product can be used for interlayer toughening and gas separation membranes of high temperature resistant epoxy and bismaleimide based carbon fiber composites. |
| 10 | Soluble polyimide ultrafine powder | SK-0190 | The glass transition temperature is greater than 320 ℃, which can be dissolved in a variety of solvents (DMF, DMAC, NMP, butyrolactone, etc.). The product can be used for interlayer toughening and gas separation membrane of high temperature resistant epoxy and bismaleimide based carbon fiber composites. |
| 11 | bmi | SK-0310 | Low melting point, solubility, good solubility, good toughness, for the defense industry and other departments. Can be used as epoxy resin modifier. |
| 12 | epoxy resin | SK-0430 | High temperature resistant resin, amber transparent, lighter in color, can be used for pultrusion pipe, rod and composite products manufacturing. |
| 13 | polyamic acid solution | SK-0910 | PMDA PI resin, manufacturing film, fiber, coating, enameled wire products etc.. |
| 14 | polyamic acid solution | SK-0920 | Ether anhydride type PI resin, water vapor resistance, used in the production of ductile film, coating, composite resin matrix. |
| 15 | polyamic acid solution | SK-0930 | PI resin, suitable for various coatings, high temperature adhesives, etc.. |
| 16 | polyamic acid solution | SK-0940 | Bisphenol A two anhydride type PI resin, used in the production of films, coatings and other products, is a good toughening modifier. |