| Number | Name | Grade | Features and uses |
| 1 | Soluble polyimide ultrafine powder | SK-0170 | The glass transition temperature is greater than 290 ℃, which can be dissolved in polar solvents (DMF, DMAC, NMP, etc.). The product can be used for interlayer toughening of high temperature resistant epoxy and bismaleimide based carbon fiber composites. |
| 2 | Soluble polyimide ultrafine powder | SK-0180 | The glass transition temperature is greater than 310 ℃, which can be dissolved in a variety of solvents (DMF, DMAC, NMP, butyrolactone, etc.). The product can be used for interlayer toughening and gas separation membranes of high temperature resistant epoxy and bismaleimide based carbon fiber composites. |
| 3 | Soluble polyimide ultrafine powder | SK-0190 | The glass transition temperature is greater than 320 ℃, which can be dissolved in a variety of solvents (DMF, DMAC, NMP, butyrolactone, etc.). The product can be used for interlayer toughening and gas separation membrane of high temperature resistant epoxy and bismaleimide based carbon fiber composites. |